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	<title>2016 &#8211; Attopsemi Technology Co., Ltd.</title>
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		<title>Vanguard International Completed Qualifying Attopsemi&#8217;s OTP in several CMOS nodes</title>
		<link>https://www.attopsemi.com/vanguard-international-completed-qualifying-attopsemis-otp-in-several-cmos-nodes/</link>
		
		<dc:creator><![CDATA[attopit]]></dc:creator>
		<pubDate>Sun, 04 Dec 2016 06:41:49 +0000</pubDate>
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					<description><![CDATA[Hsinchu, Taiwan – December 4, 2016 Attopsemi proudly announces that Vanguard International Semiconductor (VIS) Corporation has completed qualifying Attopsemi’s proprietary OTP IPs in several of their process nodes under unprecedented high temperature. Attopsemi’s fuse-based OTP, I-fuse™, has small size, low voltage, low power, high reliability, and wide temperature capabilities to enable Vanguard’s wafers in industry, [&#8230;]]]></description>
		
		
		
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		<title>Eminent Reached 10 Millions of Successful Production Chips Incorporating Attopsemi&#8217;s I-Fuse OTP</title>
		<link>https://www.attopsemi.com/eminent-reached-10-millions-of-successful-production-chips-incorporating-attopsemis-i-fuse-otp/</link>
		
		<dc:creator><![CDATA[attopit]]></dc:creator>
		<pubDate>Fri, 26 Aug 2016 06:42:53 +0000</pubDate>
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					<description><![CDATA[Hsinchu, Taiwan &#8211; August 26, 2016 Attopsemi announced today that its customer Eminent Electronic Technology, a leading fabless sensor IC company successfully embedded I-Fuse™’s OTP IP at UMC’s 0.35um mixed-signal process in proximity sensor products, and had shipped more than 10 millions of these chips for name-brand smartphones. “Attopsemi&#8217;s I-fuse™ OTP provides small size, high [&#8230;]]]></description>
		
		
		
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		<title>Attopsemi Published a Paper in ICMTS 2016, Yokohama, Japan</title>
		<link>https://www.attopsemi.com/attopsemi-published-a-paper-in-icmts-2016-yokohama-japan/</link>
		
		<dc:creator><![CDATA[attopit]]></dc:creator>
		<pubDate>Mon, 02 May 2016 06:43:51 +0000</pubDate>
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		<category><![CDATA[2016]]></category>
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					<description><![CDATA[Hsinchu, Taiwan – May 2, 2016 Attopsemi published a paper “Ultra-small and Ultra-reliable Innovative Fuse Scalable from 0.35um to 28nm” in 2016 International Conference on Microelectronic Test Structures (ICMTS). ICMTS was held in March 28 to 31, 2016 in Yokohama Japan and is the only conference dedicated to semiconductor test structures. In the well-received paper, [&#8230;]]]></description>
		
		
		
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