Attopsemi’s I-fuse OTP IP Now Qualified on a Japanese Wafer Fab’s 130 nm BCD and Embedded into ABLIC’s IC Product
Hsinchu, Taiwan – July 21, 2021
Attopsemi™ Technology, innovator of the revolutionary I-fuse™ OTP IP, together with ABLIC Inc., the IC vendor of best analog semiconductor solutions, have a successful collaboration. The companies jointly announced that I-fuse™ OTP IP is now qualified on a Japanese Wafer Fab’s 130 nm BCD process, and embedded into ABLIC’s IC Products. I-fuse™ was qualified at 150°C HTOL for 3,000hr according to JEDEC standards. Moreover, not only zero defect was found after qualification, but also the fuse resistance was not changed after such severe stress conditions. I-fuse™ OTP provides small size, low program voltage, low read voltage, wide temperature, and high reliability to satisfy ABLIC’s requirement “SMALL, SMART, SIMPLE”.
This qualification will allow customers to benefit from high reliability of I-fuse™ for any similar BCD processes from any foundries. Attopsemi has I-fuse™ IP available across all CMOS processes from 0.7 μm to 22 nm, and beyond, including G, LP, ULP, mixed signal, high voltage, BCD, and FD-SOI, etc. Indeed, I-fuse™ is a revolutionary “non-explosive” fuse technology that can be programmed below thermal runaway and above electro-migration (EM) threshold, providing small area, low read voltage/current, low program voltage/current, wide temperature, high reliability, and solving for OTP testability completely.
“We’re very excited about the prospect of our I-fuse™ IP now being qualified for incorporation into ABLIC’s 130 nm BCD process and IC product,” said Shine Chung, Chairman of Attopsemi. “We’re very pleased that our OTP was chosen by ABLIC. Thanks to the high reliability, high quality and fully testable IP, our I-fuse™ has been proven to meet ABLIC’s high-standard demands in their advanced processes and products.”