Attopsemi I-fuse® OTP was successfully adopted by Wiliot for IoT Pixels
Hsinchu, Taiwan – December 3, 2025 Attopsemi today anno […]
項目 attopit
Attopsemi Expands its Proven I-fuse® OTP Portfolio on X-FAB’s 180nm Platform
Tessenderlo, Belgium and Hsinchu, Taiwan – February 27, […]
DENSO Adopts Attopsemi’s OTP to Upgrade Future Automotive Products
Hsinchu, Taiwan – July 18, 2023 Attopsemi Technology, a […]
上峰科技劃時代 I-fuse® OTP IP通過FinFET製程矽驗證
台灣新竹，2023年4月25日 矽智財供應商上峰科技(Attopsemi)近日宣佈，其採用金屬熔絲(Metal […]
上峰科技聯手Fingerprints，生物辨識支付技術再升級
台灣新竹，2023年3月7日 OTP (One-Time Programming)矽智財供應商上峰科技(Att […]
上峰科技與X-FAB合作於XH018製程平台成功導入創新OTP I-fuse S3架構
比利時泰森德洛、台灣新竹，2022年5月10日 OTP矽智財供應商上峰科技(Attopsemi)與歐洲晶圓大廠 […]
Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk “I-fuse: A Disruptive OTP Technology”
Hsinchu, Taiwan, – Nov 20, 2019 Attopsemi Technol […]
Attopsemi’s I-fuse OTP IP Embedded into Melexis’ Sensor ICs In Mass Production
Hsinchu, Taiwan –December 10, 2019 Attopsemi’s I- […]
Attopsemi Published Two Papers About Innovative I-fuse™ 0.4V/1uA read and 250°C Bake Reliability Data on 22 nm FD-SOI at IEEE S3S Conference, 2019.
Santa Clara, California, Oct. 23, 2019 Attopsemi Techno […]
Attopsemi Technology Presented “I-fuse: Dream OTP Finally Comes True” and won the best Innovative IP award on IP SoC 2019 China
Hsinchu, Taiwan –September 18, 2019 Attopsemi Technolog […]