Entries by attopit

Attopsemi Scales I-fuse® Technology to 7nm FinFET following 12nm Silicon Success

Hsinchu, Taiwan – February 4, 2026 Attopsemi, a pioneering provider of innovative One-Time Programmable (OTP) IP solutions, today announced a significant technological leap: its proprietary I-fuse® technology has achieved silicon validation on the 7nm FinFET process. Following the previous success on 12nm process, this latest milestone reinforces Attopsemi’s technical agility in scaling its proprietary solutions […]

Attopsemi I-fuse® OTP was successfully adopted by Wiliot for IoT Pixels

Hsinchu, Taiwan – December 3, 2025 Attopsemi today announced that its ultra-low energy program/read I-fuse® OTP technology has been adopted by ambient IoT pioneer Wiliot for use in its IoT Pixels™ – battery-free, stamp-sized sensors that harvest energy from ambient radio waves. These self-powered tags attached to products, packages, and pallets to provide real-time, item-level […]

Attopsemi Expands its Proven I-fuse® OTP Portfolio on X-FAB’s 180nm Platform

Tessenderlo, Belgium and Hsinchu, Taiwan – February 27, 2025 X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, and Attopsemi Technology, the innovative one-time programmable (OTP) IP solutions provider, jointly announced today the successful demonstration of the latest version of Attopsemi’s I-fuse S3® OTP on X-FAB’s XH018 technology platform. This achievement gives X-FAB customers […]

DENSO Adopts Attopsemi’s OTP to Upgrade Future Automotive Products

Hsinchu, Taiwan – July 18, 2023 Attopsemi Technology, a leading provider of OTP IP (One-Time Programmable intellectual property), announced today a series of collaboration with Denso Corporation, a global supplier of automotive technology, to upgrade 180nm SOI technology, facilitating future installations of automotive products. I-fuse® is a revolutionary OTP whose performance surpasses those conventional ones, […]

Attopsemi’s Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology

Hsinchu, Taiwan – April 25, 2023 Attopsemi, a provider of cutting-edge One-Time Programmable (OTP) IP solutions, is excited to announce successful silicon proven of I-fuse®  to 12nm FinFET processes using metal as fuse material. With this breakthrough, Attopsemi’s OTP now can support a complete portfolio of process technologies from mature nodes to high-K metal gate […]

Latest Attopsemi I-fuse OTP Memories Based on Ground-Breaking New Architecture Now Available on X-FAB’s 180 nm Technology

Tessenderlo, Belgium and Hsinchu, Taiwan – May 10, 2022 X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, together with Attopsemi, the innovative one-time programmable (OTP) IP solutions provider, today announced that the latest version of Attopsemi‘s I-fuse® IP with its next generation architecture has been successfully demonstrated on X-FAB’s XH018 180 nm process technology. […]

Attopsemi’s I-fuse OTP IP Embedded into Melexis’ Sensor ICs In Mass Production

Hsinchu, Taiwan –December 10, 2019 Attopsemi’s I-fuse™ OTP provides small size, low program voltage, low read voltage, wide temperature, and high reliability for successful mass production in Melexis’ sensor ICs. Attopsemi Technology, a revolutionary OTP IP vendor, announced today that it recently had I-fuse™ OTP (One-Time Programmable) IP embedded into Melexis’ sensor ICs in mass […]

Attopsemi Published Two Papers About Innovative I-fuse™ 0.4V/1uA read and 250°C Bake Reliability Data on 22 nm FD-SOI at IEEE S3S Conference, 2019.

Santa Clara, California, Oct. 23, 2019 Attopsemi Technology, a revolutionary fuse-based OTP IP provider, published two papers at IEEE S3S conference on October 14th and 15th, 2019 titled “High Temperature Reliability Studies of Innovative Fuse Programming Mode” and “A 64×1 Fuse Memory with 0.4V/1μA Read and 0.9V Program Voltage on 22 nm FD-SOI” attracted lots […]