June 20, 2019 – Hsinchu We are pleased to inform you that due to the demand of business expansion, with effect from June 17, 2019, the company has been relocated to new building as following address, the main telephone and facsimile numbers remain unchanged. Our new address is: 15F-1, No. 118, Ciyun Rd., East Dist., […]
Attopsemi’s I-fuse™ provides small size, high reliability, low program voltage/current, low power and wide temperature to enable GLOBALFOUNDRIES 22nm FDX® for AI, IoT, automotive, industry, and communication applications Santa Clara, California — April 1, 2019 Attopsemi, an OTP IP provider, announced today that the company’s 256Kb OTP (One-Time Programmable) IP, manufactured on GLOBALFOUNDRIES (GF®) 22FDX® technology, passed […]
Hsinchu, Taiwan –December 20, 2018 Attopsemi Technology attended SemIsrael on November 27, 2018 in Tel Aviv, Israel and provided a talk “100% Testable OTP for Automotive.” More than 40 semiconductor chip and IP companies worldwide joined this event that attracted several hundreds of attendees. In a well-received speech during the Technical Session, Shine Chung, Chairman […]
Attopsemi’s I-fuse™ OTP provides ultra-low read voltage/current, ultra-low program voltage/current, small size and wide temperature to enable GLOBALFOUNDRIES 22nm FD-SOI for Fraunhofer Institute for Photonic Microsystems’ (IPMS) 61GHz RFID tags in IoT applications. Santa Clara, California — November 19, 2018 Attopsemi Technology, a revolutionary OTP IP vendor, announced today that it recently had 64×1 OTP […]
Hsinchu, Taiwan – October 30, 2017 Attopsemi Technology published a paper “32Kb Innovative Fuse (I-Fuse) Array in 22nm FD-SOI with 0.9V/1.4mA Program Voltage/Current and 0.744um2 Cell” for the 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S). Held in October 16-19, 2017 in San Francisco, IEEE S3S Conference is the only conference dedicated to SOI, 3D […]
Erlangen, Germany – April 25, 2017 The Fraunhofer Institute for Integrated Circuits IIS, a leading applied research and development center for ASIC, system-on-chip (SoC), and IP, today announced that it will offer dynamic biasing IPs for advanced SoC designs in GLOBALFOUNDRIES’ 22FDX® technology. This new capability offers dynamic adaption of block level performance versus power […]
Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications Santa Clara, Calif., March 27, 2017 ATTOPSEMI Technology, Ltd. today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, to provide a scalable, non-volatile one-time programmable (OTP) memory IP to be compatible with GF’s 22FDX® technology. ATTOPSEMI’s leading-edge […]
Hsinchu, Taiwan – December 4, 2016 Attopsemi proudly announces that Vanguard International Semiconductor (VIS) Corporation has completed qualifying Attopsemi’s proprietary OTP IPs in several of their process nodes under unprecedented high temperature. Attopsemi’s fuse-based OTP, I-fuse™, has small size, low voltage, low power, high reliability, and wide temperature capabilities to enable Vanguard’s wafers in industry, […]
Hsinchu, Taiwan – August 26, 2016 Attopsemi announced today that its customer Eminent Electronic Technology, a leading fabless sensor IC company successfully embedded I-Fuse™’s OTP IP at UMC’s 0.35um mixed-signal process in proximity sensor products, and had shipped more than 10 millions of these chips for name-brand smartphones. “Attopsemi’s I-fuse™ OTP provides small size, high […]
Hsinchu, Taiwan – May 2, 2016 Attopsemi published a paper “Ultra-small and Ultra-reliable Innovative Fuse Scalable from 0.35um to 28nm” in 2016 International Conference on Microelectronic Test Structures (ICMTS). ICMTS was held in March 28 to 31, 2016 in Yokohama Japan and is the only conference dedicated to semiconductor test structures. In the well-received paper, […]