Entries by martin_hsieh

DENSO Adopts Attopsemi’s OTP to Upgrade Future Automotive Products

Hsinchu, Taiwan – July 18, 2023 Attopsemi Technology, a leading provider of OTP IP (One-Time Programmable intellectual property), announced today a series of collaboration with Denso Corporation, a global supplier of automotive technology, to upgrade 180nm SOI technology, facilitating future installations of automotive products. I-fuse® is a revolutionary OTP whose performance surpasses those conventional ones, […]

Attopsemi’s Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology

Hsinchu, Taiwan – April 25, 2023 Attopsemi, a provider of cutting-edge One-Time Programmable (OTP) IP solutions, is excited to announce successful silicon proven of I-fuse®  to 12nm FinFET processes using metal as fuse material. With this breakthrough, Attopsemi’s OTP now can support a complete portfolio of process technologies from mature nodes to high-K metal gate […]

Latest Attopsemi I-fuse OTP Memories Based on Ground-Breaking New Architecture Now Available on X-FAB’s 180 nm Technology

Tessenderlo, Belgium and Hsinchu, Taiwan – May 10, 2022 X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, together with Attopsemi, the innovative one-time programmable (OTP) IP solutions provider, today announced that the latest version of Attopsemi‘s I-fuse® IP with its next generation architecture has been successfully demonstrated on X-FAB’s XH018 180 nm process technology. […]

Attopsemi’s I-fuse OTP IP Embedded into Melexis’ Sensor ICs In Mass Production

Hsinchu, Taiwan –December 10, 2019 Attopsemi’s I-fuse™ OTP provides small size, low program voltage, low read voltage, wide temperature, and high reliability for successful mass production in Melexis’ sensor ICs. Attopsemi Technology, a revolutionary OTP IP vendor, announced today that it recently had I-fuse™ OTP (One-Time Programmable) IP embedded into Melexis’ sensor ICs in mass […]

Attopsemi Published Two Papers About Innovative I-fuse™ 0.4V/1uA read and 250°C Bake Reliability Data on 22 nm FD-SOI at IEEE S3S Conference, 2019.

Santa Clara, California, Oct. 23, 2019 Attopsemi Technology, a revolutionary fuse-based OTP IP provider, published two papers at IEEE S3S conference on October 14th and 15th, 2019 titled “High Temperature Reliability Studies of Innovative Fuse Programming Mode” and “A 64×1 Fuse Memory with 0.4V/1μA Read and 0.9V Program Voltage on 22 nm FD-SOI” attracted lots […]

Attopsemi Technology Presented “I-fuse: Dream OTP Finally Comes True” and won the best Innovative IP award on IP SoC 2019 China

Hsinchu, Taiwan –September 18, 2019 Attopsemi Technology attended D&R IP SoC Day on September 12, 2019 in Shanghai, China and provided a talk “I-fuse™: Dream OTP Finally Comes True” and won the best Innovative IP award. In a well-received speech during the Technical Session, Shine Chung, Chairman of Attopsemi, presented the topic “I-fuse™: Dream OTP […]

Attopsemi Technology Attended ChipEx2019 and Presented a Speech “I-fuse A Disruptive OTP (One-Time Programmable)”

Hsinchu, Taiwan – July 16, 2019 Attopsemi Technology attended ChipEx2019 on May 3, 2019 in Tel Aviv, Israel and provided a talk “I-fuseTM A Disruptive OTP (One-Time Programmable).” ChipEx is the largest annual event of the Israeli Semiconductor industry. About 100 vendors, service providers, manufacturers of electronic design tools, components and manufacturing equipment from around […]

Attopsemi Technology’s Notification of Office Relocation

June 20, 2019 – Hsinchu We are pleased to inform you that due to the demand of business expansion, with effect from June 17, 2019, the company has been relocated to new building as following address, the main telephone and facsimile numbers remain unchanged. Our new address is: 15F-1, No. 118, Ciyun Rd., East Dist., […]