Entries by attopit

Attopsemi Published a Paper in ICMTS 2016, Yokohama, Japan

Hsinchu, Taiwan – May 2, 2016 Attopsemi published a paper “Ultra-small and Ultra-reliable Innovative Fuse Scalable from 0.35um to 28nm” in 2016 International Conference on Microelectronic Test Structures (ICMTS). ICMTS was held in March 28 to 31, 2016 in Yokohama Japan and is the only conference dedicated to semiconductor test structures. In the well-received paper, […]

I-fuse: A disruptive OTP technology for with excellent manufacturability

I-fuse* is a disruptive fuse-based OTP technology based on true electromigration with excellent manufacturability. Conventional ways of programming a fuse is by applying a large current to break the fuse such that the program behavior is like an explosion. The debris created during the explosion may micro-bridge again and grow back to cause several reliability […]

Vanguard International Signs OTP IP License Agreement with Attopsemi Technology

Attopsemi’s I-fuse™ OTP provides small size, high reliability, low program voltage, low power and wide temperature range to enable Vanguard’s specialty IC wafer business in automotive and IoT applications. Hsinchu, Taiwan – April 6, 2015 – , Vanguard International Semiconductor Corporation, a leading specialty IC foundry, announced today that it recently signed One-Time Programmable (OTP) IP […]