Attopsemi Published Two Papers About Innovative I-fuse™ 0.4V/1uA read and 250°C Bake Reliability Data on 22 nm FD-SOI at IEEE S3S Conference, 2019.
Santa Clara, California, Oct. 23, 2019 Attopsemi Technology, a revolutionary fuse-based OTP IP provider, published two papers at IEEE S3S conference on October 14th and 15th, 2019 titled “High Temperature Reliability Studies of Innovative Fuse Programming Mode” and “A 64×1 Fuse Memory with 0.4V/1μA Read and 0.9V Program Voltage on 22 nm FD-SOI” attracted lots […]
